Heat can be carried off from electronic components very effectively using cooling aggregates, as the strong air flows ensure a much greater heat dissipation per volume unit than is possible by simple free convection.
Fischer Elektronik have greatly extended their range of forced air cooling aggregates and offer appropriate systems for all applications using motor driven fans.
The large range of standard systems includes units with axial fans suitable for small and medium heat loads. Where higher efficiency is required, cooling systems with tangential or radial fans moving large volumes of air are recommended.
Various versions of cooling units are available, i.e. with small cross sections for PC boards, as medium size units for circuits with high power semi-conductors and of large design for installation in control cubicles and systems with a high rating.
The design and technical layout of the cooling aggregates are such as to optimally suit the versatile applications of electronic components and their required heat dissipation: multi module cooling units for high -capacity individual semi-conductors, compact miniature cooling aggregates for direct fastening onto boards and PCBs, high-capacity cooling units with hollow fins or a laminated structure for thyristor modules, SSR, SCR, IGBT, AC switches, bridge rectifiers and many others.
In addition to the large standard range, Fischer Elektronik produce customer-specific versions and carry out processing and modifications. Please contact us and we will be pleased to give you any advice you may require.