The leading manufacturer of heatsinks, thermal conductive materials, cases and connectors.
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MON-THR 7:30 - 15:45
FRI 7:30 - 15:15
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fsf15p2020.jpg
  • temperature range: -40°C... +150°C
  • elongation: 40 %
Phase Change thermal interface material
  • phase change material on a polyimide basis
  • very good thermal properties
  • one-sided adhesive layer eases the mounting
  • particularly suitable for the application of spring clips
  • cuts and contours upon customised drawing specifications
fsf16p_webfoto.tif
  • temperature range: -40°C... +150°C
  • elongation: 40 %
Phase Change thermal interface material
  • phase change material on a polyimide basis
  • very good thermal properties
  • one-sided adhesive layer eases the mounting
  • particularly suitable for the application of spring clips
  • cuts and contours upon customised drawing specifications
wlp.tif
  • density: 1.1 g/cm3
  • specific electrical resistance: >1012 Ω/cm
  • temperature range: -40°C ... +250°C
silicon-containing thermally conductive paste
wlpf07.jpg
  • density: 1.9 g/cm3
  • temperature range: -40°C... +150°C
silicone-free thermal transfer compound
gel45s_q.jpg
  • density: 3.2 g/cm3
  • temperature range: -40°C... +150°C
Gel thermal conductive foils for extreme compression
  • very soft and compressible thermal conductive foil
  • simple compensation of bigger differences in components
  • double-sided adhesive surfaces with protective foil
  • excellent dielectric strength
  • drawing parts acc. to customer’s specification upon request
gel80s_q.jpg
  • density: 3.3 g/cm3
  • temperature range: -40°C... +150°C
Gel thermal conductive foils for extreme compression
  • extremely strong compressible gap-filler thermal conductive foil
  • very high efficiency in connection with very high thermal conductivity
  • little force for material compression
  • perfectly suitable for balancing smallest unevennesses
  • cuts and contours according to customer drawing

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