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Thermally conductive adhesive

WLK SK 50

  • space networking thermal conductive glue made on silicone basis
  • very good thermal conductivity
  • mixing in ration 1:1 with static mixing tube
  • hardening will be proceeded at room temperature
  • wide range of temperatures
  • store cool, dark and dry
  • density: 
    2.8 g/cm3
  • temperature range: 
    -60°C... +180°C
  • dielectric constant: 
    6.9 [1 KHz]
  • heat capacity: 
    1 J/g·K
  • dielectric strength: 
    10.8 kV/mm
  • Scherfestigkeit bei RT: 
    1.4 MPa
  • class of inflammability: 
    UL 94 V-0
  • contents of delivery: 
    1x 50 ml cartridge / 3x mixer WLK SK M
Price on application
Quantity
Features
version:
2-component silicone thermal adhesive
colour:
violet
density:
2.8 g/cm3
hardness:
65 Shore A
thermal conductivity:
2 W/m·K
working life at room temperature:
approx. 30 min
hardening time:
25°C approx. 8 h / 50°C approx. 4 h / 85°C approx. 1 h
volume resistance:
1011 Ω·m
temperature range:
-60°C... +180°C
dielectric constant:
6.9 [1 KHz]
heat capacity:
1 J/g·K
dielectric strength:
10.8 kV/mm
Scherfestigkeit bei RT:
1.4 MPa
class of inflammability:
UL 94 V-0
contents of delivery:
1x 50 ml cartridge / 3x mixer WLK SK M
Accessories / similar products
Accessories:
wlk_m10.jpg
accessories
 
Accessory Product families:
1 - 10 (156)
  • 1
  • 16
Number:
ick_pga.tif
14 x 14 x 14 mm, for IC design PGA and others
 
ick_pga.tif
23 x 23 x 12.3 mm, for IC design PGA and others
 
ick_pga.tif
24.2 x 24.2 x 12.3 mm, for IC design PGA and others
 
ick_pga.tif
27,95 x 24,76 x 8 mm, for IC design PGA and others
 
ick_pga.tif
27,95 x 24,76 x 15,2 mm, for IC design PGA and others
 
ick_pga.tif
27.95 x 24.76 x 12.5 mm, for IC design PGA and others
 
ick_pga.tif
34,5 x 31.34 x 16,5 mm, for IC design PGA and others
 
ick_pga.tif
35 x 35 x 10 mm, for IC design PGA and others
 
ick_pga.tif
35 x 35 x 14 mm, for IC design PGA and others
 
ick_pga.tif
36 x 36 x 12.3 mm, for IC design PGA and others
 
1 - 10 (156)
  • 1
  • 16
Number:
Data sheet

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