Thermal conductive paste and thermal interface film |
Phase Change thermal interface material
Thermal conductive paste and thermal interface film
FSF 15 P ...
FSF 15 P 012
- phase change material on a polyimide basis
- very good thermal properties
- one-sided adhesive layer eases the mounting
- particularly suitable for the application of spring clips
- cuts and contours upon customised drawing specifications
- temperature range:-40°C... +150°C
- elongation:40 %
- volume resistance:1012 Ω·m
- dielectric constant:4.5 [1 kHz]
- tear strength:7000 psi
- dielectric strength:5 kV
- class of inflammability:UL 94 V-0
version: | electrically insulating phase change material with polyimide reinforcement and one-sided adhesive layer
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colour: | gold
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phase change temperature: | 52 °C
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thermal conductivity: | 1.5 W/m·K
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material thickness: | 0.127 mm
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temperature range: | -40°C... +150°C
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elongation: | 40 %
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volume resistance: | 1012 Ω·m
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dielectric constant: | 4.5 [1 kHz]
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tear strength: | 7000 psi
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dielectric strength: | 5 kV
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class of inflammability: | UL 94 V-0
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type of delivery: |
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FRI 7:30 - 15:15