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GAP-Filler, Heat conductive foam and gel foils

Gel thermal conducting foils

GAP-Filler, Heat conductive foam and gel foils

GEL ...
GEL G ...

GEL 20

Discontinued product -
available on request only
alternative product: GEL 14 (G) ...

  • highly heat-conductive silocon foil
  • smooth, elastic and compressible
  • equals uneven surfaces very well (Gap-Filler)
  • density: 
    2.6 g/cm3
  • temperature range: 
    -60°C ... +200°C
  • elongation: 
    100 %
  • volume resistance: 
    1·106 MΩ/m
  • dielectric constant: 
    • 5.8 [50 Hz]
    • 5.6 [1 KHz]
    • 5.5 [1 MHz]
  • dielectric loss factor: 
    • 0.048 [50 Hz]
    • 0.015 [1 KHz]
    • 0.003 [1 MHz]
  • dielectric strength: 
    14 kV/mm (AC)
  • class of inflammability: 
    UL 94 V-0
Price on application
Quantity
Features
material:
GEL foil
material thickness:
2±0,300 mm
version:
standard
colour:
dark gray
density:
2.6 g/cm3
hardness:
49 Shore 00
thermal conductivity:
1.5 W/m·K
thermal resistance:
9.78 °C cm2/W
thermal resistance (100 kPa):
1.52 °C in2/W
temperature range:
-60°C ... +200°C
elongation:
100 %
volume resistance:
1·106 MΩ/m
dielectric constant:
  • 5.8 [50 Hz]
  • 5.6 [1 KHz]
  • 5.5 [1 MHz]
dielectric loss factor:
  • 0.048 [50 Hz]
  • 0.015 [1 KHz]
  • 0.003 [1 MHz]
dielectric strength:
14 kV/mm (AC)
class of inflammability:
UL 94 V-0
type of delivery:
  • on both sides covered with protective foil
  • plates, usable area 300x200mm
  • other dimensions upon request
Variants
1 - 10 (19)Number:
gel_g_16_-e.jpg
  • density: 2.6 g/cm3
  • thermal resistance: 4.45 °C cm2/W
  • thermal resistance (100 kPa): 0.69 °C in2/W
  • temperature range: -60°C ... +200°C
Discontinued product -
available on request only
alternative product: GEL 14 (G) ...

  • highly heat-conductive silocon foil
  • smooth, elastic and compressible
  • equals uneven surfaces very well (Gap-Filler)
 
gel_g_16_-e.jpg
  • density: 2.6 g/cm3
  • thermal resistance: 6.64 °C cm2/W
  • thermal resistance (100 kPa): 1.03 °C in2/W
  • temperature range: -60°C ... +200°C
Discontinued product -
available on request only
alternative product: GEL 14 (G) ...

  • highly heat-conductive silocon foil
  • smooth, elastic and compressible
  • equals uneven surfaces very well (Gap-Filler)
 
gel_g_16_-e.jpg
  • density: 2.6 g/cm3
  • thermal resistance: 8.96 °C cm2/W
  • thermal resistance (100 kPa): 1.39 °C in2/W
  • temperature range: -60°C ... +200°C
Discontinued product -
available on request only
alternative product: GEL 14 (G) ...

  • highly heat-conductive silocon foil
  • smooth, elastic and compressible
  • equals uneven surfaces very well (Gap-Filler)
 
gel_g_16_-e.jpg
  • density: 2.6 g/cm3
  • thermal resistance: 13.58 °C cm2/W
  • thermal resistance (100 kPa): 2.1 °C in2/W
  • temperature range: -60°C ... +200°C
Discontinued product -
available on request only
alternative product: GEL 14 (G) ...

  • highly heat-conductive silocon foil
  • smooth, elastic and compressible
  • equals uneven surfaces very well (Gap-Filler)
 
gel_g_16_-e.jpg
  • density: 2.6 g/cm3
  • thermal resistance: 15.15 °C cm2/W
  • thermal resistance (100 kPa): 2.35 °C in2/W
  • temperature range: -60°C ... +200°C
Discontinued product -
available on request only
alternative product: GEL 14 (G) ...

  • highly heat-conductive silocon foil
  • smooth, elastic and compressible
  • equals uneven surfaces very well (Gap-Filler)
 
gel_g_16_-e.jpg
  • density: 2.6 g/cm3
  • thermal resistance: 16.51 °C cm2/W
  • thermal resistance (100 kPa): 2.56 °C in2/W
  • temperature range: -60°C ... +200°C
Discontinued product -
available on request only
alternative product: GEL 14 (G) ...

  • highly heat-conductive silocon foil
  • smooth, elastic and compressible
  • equals uneven surfaces very well (Gap-Filler)
 
gel_g_16_-e.jpg
  • density: 2.6 g/cm3
  • thermal resistance: 20.95 °C cm2/W
  • thermal resistance (100 kPa): 3.25 °C in2/W
  • temperature range: -60°C ... +200°C
Discontinued product -
available on request only
alternative product: GEL 14 (G) ...

  • highly heat-conductive silocon foil
  • smooth, elastic and compressible
  • equals uneven surfaces very well (Gap-Filler)
 
gel_g_16_-e.jpg
  • density: 2.6 g/cm3
  • thermal resistance: 21.82 °C cm2/W
  • thermal resistance (100 kPa): 3.38 °C in2/W
  • temperature range: -60°C ... +200°C
Discontinued product -
available on request only
alternative product: GEL 14 (G) ...

  • highly heat-conductive silocon foil
  • smooth, elastic and compressible
  • equals uneven surfaces very well (Gap-Filler)
 
gel_g_16_-e.jpg
  • density: 2.6 g/cm3
  • thermal resistance: 22.7 °C cm2/W
  • thermal resistance (100 kPa): 3.52 °C in2/W
  • temperature range: -60°C ... +200°C
Discontinued product -
available on request only
alternative product: GEL 14 (G) ...

  • highly heat-conductive silocon foil
  • smooth, elastic and compressible
  • equals uneven surfaces very well (Gap-Filler)
 
gel_g_16_-e.jpg
  • density: 2.6 g/cm3
  • thermal resistance: 4.04 °C cm2/W
  • thermal resistance (100 kPa): 0.63 °C in2/W
  • temperature range: -60°C ... +200°C
Discontinued product -
available on request only
alternative product: GEL 14 (G) ...

  • highly heat-conductive silocon foil
  • smooth, elastic and compressible
  • equals uneven surfaces very well (Gap-Filler)
 
1 - 10 (19)Number:
* This information refers to the standard variant of the product, so it might change when another variant is chosen.
Accessories / similar products
Accessory Product families:
gel28_16_.jpg
  • GEL thermal conductive foils with very good thermical characteristics
  • for balancing non-planarities and differences in components (gap-filler)
  • soft, elastic and compressible
  • customer specific cuts and punchings according to drawing
 
gel27_60_16_.jpg
Gel thermal conductive foils for extreme compression
  • specially soft design
  • levels smallest air gaps and unevennesses
  • cuts and contours with cutouts according to customer's specifactions
 
gel60_16_.jpg
Gel thermal conducting foils
  • GEL silicone foils with especially high thermal conductivity
  • balances non-planarities and differences in components (Gap filler)
  • soft, elastic and compressible
  • cuts, punchings and special designs according to customer specifications
 
Product family accessory of product family:
wsf_wsfs_16_.jpg
  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]0.30.40.450.65

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
 
Data sheet

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