The leading manufacturer of heatsinks, thermal conductive materials, cases and connectors.
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Pin heatsinks

ICK S R 100 x 50

Ø 100 x 50 mm, pin heatsinks round
Price on application
Quantity
Features
design:
round
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
diameter:
100 mm
height:
50 mm
plate thickness:
10 mm
weight:
320 g
thermal resistance:
2.3 - 0.3 K/W
dissipation loss:
26 W
surface:
black anodised
Technical Drawing
Service
Drawing format (such as PDF, CAD)
Data sheet

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