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Heat dissipating case

Accessory for the embedded case

bfs_emb.tif
bfs_emb.eps

Heat dissipating case

BFS ...

BFS 30

Accessory for the embedded case, insulating
Price on application
Quantity
Variants
bfs_emb.tif
  • L

    :
    15 mm
Accessory for the embedded case, insulating
 
bfs_emb.tif
  • L

    :
    20 mm
Accessory for the embedded case, insulating
 
bfs_emb.tif
  • L

    :
    25 mm
Accessory for the embedded case, insulating
 
bfs_emb.tif
  • L

    :
    35 mm
Accessory for the embedded case, insulating
 
bfs_emb.tif
  • L

    :
    40 mm
Accessory for the embedded case, insulating
 
* This information refers to the standard variant of the product, so it might change when another variant is chosen.
Technical Drawing

L

:
30 mm
Accessories / similar products
Product family accessory of product family:
emb_.tif
Embedded case
contents of delivery: 1 = 1 x case profile; 2 = 2 x cover panel; 3 = 1 x bottom panel; 4 = mounting material
 
  • universal cooling fin case made of aluminium extruded profile, cover panels in 2 mm thickness and removable bottom panel
  • optimized heat dissipation by means of external cooling fins
  • the integrated T-grooves in the case profile for mounting of i.e. mainboards in the Mini-ITX or NUC form factor by means of distance, bolts and mounting plate also EBX, Nano ITX, EPIC, ETX/XTX and PC/104 form factors by means
  • internal guide grooves for inserting PCBs or mounting plates
  • wall-, ceiling- or top-hat rail mounting by means of fixing straps or top-hat rail mounting from the bottom
  • special designs, embedded cover panels, machinings, surfaces and printings upon request

* accessories mounting set BFS
 
emb_explosion.tif
Embedded case
contents of delivery: 1 = 1 x case profile; 2 = 2 x cover panel; 3 = 1 x bottom panel; 4 = mounting material
 
  • universal cooling fin case made of aluminium extruded profile, cover panels in 2 mm thickness and removable bottom panel
  • optimized heat dissipation by means of external cooling fins
  • the integrated T-grooves in the case profile for mounting of i.e. mainboards in the Mini-ITX or NUC form factor by means of distance, bolts and mounting plate also EBX, Nano ITX, EPIC, ETX/XTX and PC/104 form factors by means
  • internal guide grooves for inserting PCBs or mounting plates
  • wall-, ceiling- or top-hat rail mounting by means of fixing straps or top-hat rail mounting from the bottom
  • special designs, embedded cover panels, machinings, surfaces and printings upon request

* accessories mounting set BFS
 
emb_.tif
Embedded case
contents of delivery: 1 = 1 x case profile; 2 = 2 x cover panel; 3 = 1 x bottom panel; 4 = mounting material
 
  • universal cooling fin case made of aluminium extruded profile, cover panels in 2 mm thickness and removable bottom panel
  • optimized heat dissipation by means of external cooling fins
  • the integrated T-grooves in the case profile for mounting of i.e. mainboards in the Mini-ITX or NUC form factor by means of distance, bolts and mounting plate also EBX, Nano ITX, EPIC, ETX/XTX and PC/104 form factors by means
  • internal guide grooves for inserting PCBs or mounting plates
  • wall-, ceiling- or top-hat rail mounting by means of fixing straps or top-hat rail mounting from the bottom
  • special designs, embedded cover panels, machinings, surfaces and printings upon request

* accessories mounting set BFS
 
Data sheet

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