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Results in products

1 - 12 (16)
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ksk1.jpg
  • skiving heatsink with exactly milled flat semiconductor mounting surface and low roughness depths
  • particularly suitable for thermoelectric and similar power modules
  • optimal heat transfer resistance from the base plate to the individual fins, as the heatsinks are made from one piece of material
  • very good heat conducting aluminum material EN AW 1050 A
  • extremely compact and high fin density for forced convection
  • great design flexibility and fast prototyping
  • skived heatsinks made of copper material on request
  • heatsink width = length
  • additional mechanical processing, other designs and dimensions according to customer-specific requirements
ksk2.jpg
  • skiving heatsink with exactly milled flat semiconductor mounting surface and low roughness depths
  • particularly suitable for thermoelectric and similar power modules
  • optimal heat transfer resistance from the base plate to the individual fins, as the heatsinks are made from one piece of material
  • very good heat conducting aluminum material EN AW 1050 A
  • extremely compact and high fin density for forced convection
  • great design flexibility and fast prototyping
  • skived heatsinks made of copper material on request
  • heatsink width = length
  • additional mechanical processing, other designs and dimensions according to customer-specific requirements
ksk3.jpg
  • skiving heatsink with exactly milled flat semiconductor mounting surface and low roughness depths
  • particularly suitable for thermoelectric and similar power modules
  • optimal heat transfer resistance from the base plate to the individual fins, as the heatsinks are made from one piece of material
  • very good heat conducting aluminum material EN AW 1050 A
  • extremely compact and high fin density for forced convection
  • great design flexibility and fast prototyping
  • skived heatsinks made of copper material on request
  • heatsink width = length
  • additional mechanical processing, other designs and dimensions according to customer-specific requirements
ksk4.jpg
  • skiving heatsink with exactly milled flat semiconductor mounting surface and low roughness depths
  • particularly suitable for thermoelectric and similar power modules
  • optimal heat transfer resistance from the base plate to the individual fins, as the heatsinks are made from one piece of material
  • very good heat conducting aluminum material EN AW 1050 A
  • extremely compact and high fin density for forced convection
  • great design flexibility and fast prototyping
  • skived heatsinks made of copper material on request
  • heatsink width = length
  • additional mechanical processing, other designs and dimensions according to customer-specific requirements
ksk5.jpg
  • skiving heatsink with exactly milled flat semiconductor mounting surface and low roughness depths
  • particularly suitable for thermoelectric and similar power modules
  • optimal heat transfer resistance from the base plate to the individual fins, as the heatsinks are made from one piece of material
  • very good heat conducting aluminum material EN AW 1050 A
  • extremely compact and high fin density for forced convection
  • great design flexibility and fast prototyping
  • skived heatsinks made of copper material on request
  • heatsink width = length
  • additional mechanical processing, other designs and dimensions according to customer-specific requirements
ksk6.jpg
  • skiving heatsink with exactly milled flat semiconductor mounting surface and low roughness depths
  • particularly suitable for thermoelectric and similar power modules
  • optimal heat transfer resistance from the base plate to the individual fins, as the heatsinks are made from one piece of material
  • very good heat conducting aluminum material EN AW 1050 A
  • extremely compact and high fin density for forced convection
  • great design flexibility and fast prototyping
  • skived heatsinks made of copper material on request
  • heatsink width = length
  • additional mechanical processing, other designs and dimensions according to customer-specific requirements
ksk7.jpg
  • skiving heatsink with exactly milled flat semiconductor mounting surface and low roughness depths
  • particularly suitable for thermoelectric and similar power modules
  • optimal heat transfer resistance from the base plate to the individual fins, as the heatsinks are made from one piece of material
  • very good heat conducting aluminum material EN AW 1050 A
  • extremely compact and high fin density for forced convection
  • great design flexibility and fast prototyping
  • skived heatsinks made of copper material on request
  • heatsink width = length
  • additional mechanical processing, other designs and dimensions according to customer-specific requirements
ksk8.jpg
  • skiving heatsink with exactly milled flat semiconductor mounting surface and low roughness depths
  • particularly suitable for thermoelectric and similar power modules
  • optimal heat transfer resistance from the base plate to the individual fins, as the heatsinks are made from one piece of material
  • very good heat conducting aluminum material EN AW 1050 A
  • extremely compact and high fin density for forced convection
  • great design flexibility and fast prototyping
  • skived heatsinks made of copper material on request
  • heatsink width = length
  • additional mechanical processing, other designs and dimensions according to customer-specific requirements
ksk9.jpg
  • skiving heatsink with exactly milled flat semiconductor mounting surface and low roughness depths
  • particularly suitable for thermoelectric and similar power modules
  • optimal heat transfer resistance from the base plate to the individual fins, as the heatsinks are made from one piece of material
  • very good heat conducting aluminum material EN AW 1050 A
  • extremely compact and high fin density for forced convection
  • great design flexibility and fast prototyping
  • skived heatsinks made of copper material on request
  • heatsink width = length
  • additional mechanical processing, other designs and dimensions according to customer-specific requirements
ksk10.jpg
  • skiving heatsink with exactly milled flat semiconductor mounting surface and low roughness depths
  • particularly suitable for thermoelectric and similar power modules
  • optimal heat transfer resistance from the base plate to the individual fins, as the heatsinks are made from one piece of material
  • very good heat conducting aluminum material EN AW 1050 A
  • extremely compact and high fin density for forced convection
  • great design flexibility and fast prototyping
  • skived heatsinks made of copper material on request
  • heatsink width = length
  • additional mechanical processing, other designs and dimensions according to customer-specific requirements
ksk11.jpg
  • skiving heatsink with exactly milled flat semiconductor mounting surface and low roughness depths
  • particularly suitable for thermoelectric and similar power modules
  • optimal heat transfer resistance from the base plate to the individual fins, as the heatsinks are made from one piece of material
  • very good heat conducting aluminum material EN AW 1050 A
  • extremely compact and high fin density for forced convection
  • great design flexibility and fast prototyping
  • skived heatsinks made of copper material on request
  • heatsink width = length
  • additional mechanical processing, other designs and dimensions according to customer-specific requirements
ksk12.jpg
  • skiving heatsink with exactly milled flat semiconductor mounting surface and low roughness depths
  • particularly suitable for thermoelectric and similar power modules
  • optimal heat transfer resistance from the base plate to the individual fins, as the heatsinks are made from one piece of material
  • very good heat conducting aluminum material EN AW 1050 A
  • extremely compact and high fin density for forced convection
  • great design flexibility and fast prototyping
  • skived heatsinks made of copper material on request
  • heatsink width = length
  • additional mechanical processing, other designs and dimensions according to customer-specific requirements
1 - 12 (16)
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* This information refers to the standard variant of the product, so it might change when another variant is chosen.

Results in variants

1 - 12 (16)
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ksk1.jpg
 
ksk10.jpg
 
ksk11.jpg
 
ksk12.jpg
 
ksk2.jpg
 
ksk3.jpg
 
ksk3_421_12.tif
 
ksk3_421_14.tif
 
ksk3_421_14.tif
 
ksk3_421_08.tif
 
ksk4.jpg
 
ksk5.jpg
 
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