JavaScript einschalten! / activate JavaScript!
Newsletter subscription
.
Don't fill this field!
en
Deutsch
.
English
.
français
.
čeština
.
Products
.
Heatsinks f.cool -
product search
.
Thermally conductive material
.
Cases f.case -
product search
.
Connectors f.con -
product search
.
Company
.
Guidelines
.
Quality policy
.
Charity
.
The enterprise
.
Company Profile
.
Company video
.
Company history
.
Certification
.
General sales conditions
.
General Terms and
Conditions of Business
.
Contract Terms and
Conditions for
Purchase Orders and
Call-off Orders
.
Latest news
.
Press releases
.
Newsletter
.
2019
.
10
Fair activity:
SPS Nuremberg 2019
.
09
Fastening for mounting rail
KL 35 ...
.
08
Fair activity:
MES Expo Berlin 2019/
SPS Nuremberg 2019
.
07
Miniature cooling aggregates
LAM 5 D K ...
.
06
Fair activity:
Forum de l‘électronique 2019
in Paris Expo /
Porte de Versaille
.
05
USB connectors
USB 31 C,
RJ 45 LED
.
04
19" insert with low depth
VESA GT ...
.
03
Fair activity:
PCIM & Power2Drive 2019
.
02
Heatsinks for LEDs
SK 658 ...,
SK 659 ...,
SK 660 ...
.
01
Fair activity:
Embedded World 2019
.
2018
.
08
Male headers
SLV W 4 ...
SLV W 4 SMD ...
.
07
Fair activity:
electronica 2018
.
06
Cases
.
05
Thermally conductive material
.
04
Fair activity:
HIGH END 2018
.
03
Fair activity:
light+building 2018
.
02
Fair activity:
Embedded World 2018
light+building 2018
.
01
Female headers:
Low profile, fork contact spring
BL LP 5 SMD ...
BL LP 6 SMD ...
.
Exhibitions and Conventions
.
Service
.
Catalogue
.
Order catalogue
.
E-Paper
.
Newsletter subscription
.
Subscribe newsletter
.
Unsubscribe newsletter
.
Sample
.
Sample service for thermal conductive foils
.
Functional model service
mounting rail adaptor
KL 35
.
CAD data exchange
.
Downloads
.
Brochures
.
Fischer Elektronik:
short form
.
LED
.
Segment-, miniature- and high capacity cooling aggregates
.
SOLAR
.
LOGOS "DOWNLOAD"
.
Technical advice
.
Requirements for printings
.
Technical informations
.
Thermal resistance of a heatsink
.
Computer-assisted thermal simulation
.
Links
.
General links
.
LED-Partner
.
Sampling
.
Contact
.
Representations worldwide
.
Distributors worldwide
.
Itinerary
.
Heatsinks
Heatsinks
f.cool
Profile heatsinks and fluid coolers
Heatsinks and active heatsinks for processors
Board Level heatsinks
Cooling aggregates
Accessories for electronic components
Cases
f.case
Connectors
f.con
1 - 12 (1,182)
«
‹
1
2
3
›
»
Number:
12
24
48
96
WSF ...
elastomer foam with closed cell structure
good heat conductor e.g. between components, heatsinks and casing parts
electrical insulating
can be compressed even with a low contact pressure
absorbs shocks and vibrations
Thermal resistance at 3.2 mm material thickness:
compression [%]
contact
10
25
50
contact pressure [psi]
>1
5
12
34
R
th
[K/W] (1 in
2
x 3.2 mm)
6
4.5
2.5
1
heat conductivity [W/mK]
0.3
0.4
0.45
0.65
WSFS 635
double sided adhesive and
WSF
self-adhesive upon request
according to NASA gas emission requirements
KK 1 3,96
for semiconductor-design TO 5 and others
KK 1 6,35
for semiconductor-design TO 5 and others
KK 1 12,07
for semiconductor-design TO 5 and others
KK 1 19,05
for semiconductor-design TO 5 and others
SK 68 ...
46 x 33 mm, profile threads
SK 112 ...
46 x 33 mm, profile threads
ICK ... L
6,3 x 4,8 mm, for DIL IC 6, 8, 14, 16, 20 -pole
LA ICK ...
universal fan coolers
ICK ... B
19 x 4,8 mm, for DIL IC 14, 16, 24, 28, 36, 40 -pole
ICK PPC 51
for Power PC
ICK PEN 3 XE
for Intel Pentium III Xeon
1 - 12 (1,182)
«
‹
1
2
3
›
»
Number:
12
24
48
96