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wsf_wsfs_16_.jpg
  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]0.30.40.450.65

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
kk1_03_96_schatten.jpg
for semiconductor-design TO 5 and others
kk1_06_35_schatten.jpg
for semiconductor-design TO 5 and others
kk1_12_07_schatten.jpg
for semiconductor-design TO 5 and others
kk1_19_05_schatten.jpg
for semiconductor-design TO 5 and others
sk68.tif
46 x 33 mm, profile threads
sk112.tif
46 x 33 mm, profile threads
ick_l.tif
6,3 x 4,8 mm, for DIL IC 6, 8, 14, 16, 20 -pole
la_ick.tif
universal fan coolers
ick_b.tif
19 x 4,8 mm, for DIL IC 14, 16, 24, 28, 36, 40 -pole
ick_ppc.tif
for Power PC
ick_pen3xe.tif
for Intel Pentium III Xeon
1 - 12 (1,188)Number:

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