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Thermal interface material

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wsf_wsfs_16_.jpg
  • density: 1.105 g/cm3
  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]0.30.40.450.65

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
wsf_wsfs_16_.jpg
  • density: 1.105 g/cm3
  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]0.30.40.450.65

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
wsf_wsfs_16_.jpg
  • density: 1.105 g/cm3
  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]0.30.40.450.65

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
wsf_wsfs_16_.jpg
  • density: 1.105 g/cm3
  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]0.30.40.450.65

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
wsf_wsfs_16_.jpg
  • density: 1.105 g/cm3
  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]0.30.40.450.65

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
wsf_wsfs_16_.jpg
  • density: 1.105 g/cm3
  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]0.30.40.450.65

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
wsf_wsfs_16_.jpg
  • density: 1.105 g/cm3
can be compressed, electrical insulating; one-sided adhesive
wfpk09.tif
  • thermal conductive foil based on polyester
  • particularly suitable for silicone-free applications
  • very good insulating properties
  • one-sided adhesive layer upon request
  • cuts and contours according to customer specific drawing specifications
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1 - 12 (488)
  • 1
  • 41
Number:
* This information refers to the standard variant of the product, so it might change when another variant is chosen.

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