silicon-containing thermally conductive paste
|
silicon-containing thermally conductive paste
|
non isolations, double-sided adhesive
|
non isolations, double-sided adhesive
|
thermal resistance: 0.3 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (AOS 3 G)]
TO 218, TO 247, 25 x 21 x 1.5 mm, other strengths and versions on request
|
thermal resistance: 0.3 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (AOS 3 G)]
TO 218, TO 247, 25 x 21 x 1.5 mm, other strengths and versions on request
|
thermal resistance (GS 3): 0.4 K/W
TOP 3, 20.5 x 17.5 mm, customer specific versions on request
|
thermal resistance (GS 3): 0.4 K/W
TOP 3, 20.5 x 17.5 mm, customer specific versions on request
|
thermal resistance: 0.15 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (KAP 3)]
for semiconductor-design TO 218, 23 x 18 mm
|
thermal resistance: 0.15 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (KAP 3)]
for semiconductor-design TO 218, 23 x 18 mm
|
- very soft thermal conductive foil
- without any reinforcing layer
- optimal balance of bigger unevennesses
- thermal conductive foil both-sided adherent
- cuts and contours according to customer specific drawing specifications
|
- very soft thermal conductive foil
- without any reinforcing layer
- optimal balance of bigger unevennesses
- thermal conductive foil both-sided adherent
- cuts and contours according to customer specific drawing specifications
|
thermal resistance: 0.165 K/W
- thermal conductive foil for silicone-free applications
- epoxy-based thermal conductive foil
- excellent insulation properties
- cut to size and contours according to customised drawing specifications
|
thermal resistance: 0.165 K/W
- thermal conductive foil for silicone-free applications
- epoxy-based thermal conductive foil
- excellent insulation properties
- cut to size and contours according to customised drawing specifications
|
isolations, double sided adhesive
|
isolations, double sided adhesive
|
Discontinued product - available on request only
silicone-free thermal transfer compound
|
Discontinued product - available on request only
silicone-free thermal transfer compound
|
thermally conductive, electrically not conductive
|
thermally conductive, electrically not conductive
|
thermal resistance: 0.3 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (AOS 3 G)]
TOP 3, 23 x 20 x 1 mm, other strengths and versions on request
|
thermal resistance: 0.3 K/W [at 1 inch2; = 6.45 cm2; = TO 3 (AOS 3 G)]
TOP 3, 23 x 20 x 1 mm, other strengths and versions on request
|
thermal resistance (GS 3): 0.4 K/W
TO 66, 18 x 13,5 mm, customer specific versions on request
|
thermal resistance (GS 3): 0.4 K/W
TO 66, 18 x 13,5 mm, customer specific versions on request
|
FRI 7:30 - 15:15