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fsf52p_.jpg
Phase Change thermal conductive material
  • strapless (free standing film) changing condition thermal conductive material as a foil
  • material with phase changing temperature at 48 °C or 52 °C
  • best thermal conductivity, above the phase change temperature the material flows in all gaps of the impinged device and heatsink
  • thixotropic, therefore no migration of the material away from the moistened surface
  • no influence on the thermal conductivity due to thermal cycles
  • only low contact pressure necessary, as it is no elastomer and therefore ideally suitable for clamp mounting of the devices
  • not electrically conductive, but no insulator
  • self-adhesive properties, also suitable for large surfaces
  • no toxic ingredients
  • customised cuts upon request
  • with double-sided protective film
  • density: -
fsf15p.tif
Phase Change thermal conductive material
  • phase change material on a polyimide basis
  • very good thermal properties
  • one-sided adhesive layer eases the mounting
  • particularly suitable for the application of spring clips
  • cuts and contours upon customised drawing specifications
  • density: -
fsf16p_webfoto.tif
Phase Change thermal conductive material
  • phase change material on a polyimide basis
  • very good thermal properties
  • one-sided adhesive layer eases the mounting
  • particularly suitable for the application of spring clips
  • cuts and contours upon customised drawing specifications
  • density: -
wlp.tif
silicon-containing thermally conductive paste
  • density: 1.1 g/cm3
wlpf.tif
silicone-free thermal transfer compound
  • density: approx. 2 g/cm3
wlpk.tif
Ceramic filled, silicone-free thermal conductive paste with high thermal conductivity
  • density: 1.4 g/cm3