thermal resistance (1 in2, TO 3) at contact pressure of: 0.1 K/W 0.031 N/mm2
temperature range: ≤+150°C
adhesive holding force: 0.6 N/mm2
Phase Change thermal interface material- strapless (free standing film) changing condition thermal conductive material as a foil
- material with phase changing temperature at 48 °C or 52 °C
- best thermal conductivity, above the phase change temperature the material flows in all gaps of the impinged device and heatsink
- thixotropic, therefore no migration of the material away from the moistened surface
- no influence on the thermal conductivity due to thermal cycles
- only low contact pressure necessary, as it is no elastomer and therefore ideally suitable for clamp mounting of the devices
- not electrically conductive, but no insulator
- self-adhesive properties, also suitable for large surfaces
- no toxic ingredients
- customised cuts upon request
- with double-sided protective film
|
thermal resistance (1 in2, TO 3) at contact pressure of: 0.1 K/W 0.031 N/mm2
temperature range: ≤+150°C
adhesive holding force: 0.6 N/mm2
Phase Change thermal interface material- strapless (free standing film) changing condition thermal conductive material as a foil
- material with phase changing temperature at 48 °C or 52 °C
- best thermal conductivity, above the phase change temperature the material flows in all gaps of the impinged device and heatsink
- thixotropic, therefore no migration of the material away from the moistened surface
- no influence on the thermal conductivity due to thermal cycles
- only low contact pressure necessary, as it is no elastomer and therefore ideally suitable for clamp mounting of the devices
- not electrically conductive, but no insulator
- self-adhesive properties, also suitable for large surfaces
- no toxic ingredients
- customised cuts upon request
- with double-sided protective film
|
thermal resistance (1 in2, TO 3) at contact pressure of: 0.08 K/W 0.031 N/mm2
temperature range: ≤+150°C
adhesive holding force: 0.6 N/mm2
Phase Change thermal interface material- strapless (free standing film) changing condition thermal conductive material as a foil
- material with phase changing temperature at 48 °C or 52 °C
- best thermal conductivity, above the phase change temperature the material flows in all gaps of the impinged device and heatsink
- thixotropic, therefore no migration of the material away from the moistened surface
- no influence on the thermal conductivity due to thermal cycles
- only low contact pressure necessary, as it is no elastomer and therefore ideally suitable for clamp mounting of the devices
- not electrically conductive, but no insulator
- self-adhesive properties, also suitable for large surfaces
- no toxic ingredients
- customised cuts upon request
- with double-sided protective film
|
thermal resistance (1 in2, TO 3) at contact pressure of: 0.08 K/W 0.031 N/mm2
temperature range: ≤+150°C
adhesive holding force: 0.6 N/mm2
Phase Change thermal interface material- strapless (free standing film) changing condition thermal conductive material as a foil
- material with phase changing temperature at 48 °C or 52 °C
- best thermal conductivity, above the phase change temperature the material flows in all gaps of the impinged device and heatsink
- thixotropic, therefore no migration of the material away from the moistened surface
- no influence on the thermal conductivity due to thermal cycles
- only low contact pressure necessary, as it is no elastomer and therefore ideally suitable for clamp mounting of the devices
- not electrically conductive, but no insulator
- self-adhesive properties, also suitable for large surfaces
- no toxic ingredients
- customised cuts upon request
- with double-sided protective film
|
temperature range: -40°C... +150°C
Phase Change thermal interface material
- phase change material on a polyimide basis
- very good thermal properties
- one-sided adhesive layer eases the mounting
- particularly suitable for the application of spring clips
- cuts and contours upon customised drawing specifications
|
temperature range: -40°C... +150°C
Phase Change thermal interface material
- phase change material on a polyimide basis
- very good thermal properties
- one-sided adhesive layer eases the mounting
- particularly suitable for the application of spring clips
- cuts and contours upon customised drawing specifications
|
temperature range: -40°C... +150°C
Phase Change thermal interface material
- phase change material on a polyimide basis
- very good thermal properties
- one-sided adhesive layer eases the mounting
- particularly suitable for the application of spring clips
- cuts and contours upon customised drawing specifications
|
temperature range: -40°C... +150°C
Phase Change thermal interface material
- phase change material on a polyimide basis
- very good thermal properties
- one-sided adhesive layer eases the mounting
- particularly suitable for the application of spring clips
- cuts and contours upon customised drawing specifications
|
temperature range: -40°C... +150°C
Phase Change thermal interface material
- phase change material on a polyimide basis
- very good thermal properties
- one-sided adhesive layer eases the mounting
- particularly suitable for the application of spring clips
- cuts and contours upon customised drawing specifications
|
temperature range: -40°C... +150°C
Phase Change thermal interface material
- phase change material on a polyimide basis
- very good thermal properties
- one-sided adhesive layer eases the mounting
- particularly suitable for the application of spring clips
- cuts and contours upon customised drawing specifications
|
temperature range: -40°C... +150°C
Phase Change thermal interface material
- phase change material on a polyimide basis
- very good thermal properties
- one-sided adhesive layer eases the mounting
- particularly suitable for the application of spring clips
- cuts and contours upon customised drawing specifications
|
temperature range: -40°C... +150°C
Phase Change thermal interface material
- phase change material on a polyimide basis
- very good thermal properties
- one-sided adhesive layer eases the mounting
- particularly suitable for the application of spring clips
- cuts and contours upon customised drawing specifications
|
temperature range: -40°C... +150°C
Phase Change thermal interface material
- phase change material on a polyimide basis
- very good thermal properties
- one-sided adhesive layer eases the mounting
- particularly suitable for the application of spring clips
- cuts and contours upon customised drawing specifications
|
temperature range: -40°C... +150°C
Phase Change thermal interface material
- phase change material on a polyimide basis
- very good thermal properties
- one-sided adhesive layer eases the mounting
- particularly suitable for the application of spring clips
- cuts and contours upon customised drawing specifications
|
temperature range: -40°C... +150°C
Phase Change thermal interface material
- phase change material on a polyimide basis
- very good thermal properties
- one-sided adhesive layer eases the mounting
- particularly suitable for the application of spring clips
- cuts and contours upon customised drawing specifications
|
temperature range: -40°C... +150°C
Phase Change thermal interface material
- phase change material on a polyimide basis
- very good thermal properties
- one-sided adhesive layer eases the mounting
- particularly suitable for the application of spring clips
- cuts and contours upon customised drawing specifications
|
temperature range: -40°C ... +250°C
silicon-containing thermally conductive paste
|
temperature range: -40°C ... +250°C
silicon-containing thermally conductive paste
|
temperature range: -40°C ... +250°C
silicon-containing thermally conductive paste
|
temperature range: -40°C ... +250°C
silicon-containing thermally conductive paste
|
temperature range: -40°C ... +250°C
silicon-containing thermally conductive paste
|
temperature range: -40°C ... +250°C
silicon-containing thermally conductive paste
|
temperature range: -40°C ... +250°C
silicon-containing thermally conductive paste
|
temperature range: -40°C ... +250°C
silicon-containing thermally conductive paste
|
FRI 7:30 - 15:15