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Thermal conductive paste and thermal interface film

Thermal conductive paste

Thermal conductive paste and thermal interface film

WLP ...

WLP 500 S

silicon-containing thermally conductive paste
  • density: 
    1.1 g/cm3
  • temperature range: 
    -40°C ... +250°C
Price on application
Quantity
Features
material:
silicon thermal transfer compound
composition:
silicone oil, inorganic filling material
basin:
cartridge (310 ml)
specific electrical resistance:
>1012 Ω/cm
flashpoint:
none (DIN 53213)
drop point:
>260°C
delivery quantity:
500 g
thermal resistance:
no bleeding at (4 h/200°C)
acid number:
< 0.01 mg KOH/g
consistance:
pastey
colour:
white
density:
1.1 g/cm3
thermal conductivity:
0.61 W/m·K
temperature range:
-40°C ... +250°C
solubility in water:
insoluble
Variants
wlp.tif
  • basin: box
  • delivery quantity: 4 g
  • density: 1.1 g/cm3
  • temperature range: -40°C ... +250°C
silicon-containing thermally conductive paste
 
wlp.tif
  • basin: box
  • delivery quantity: 35 g
  • density: 1.1 g/cm3
  • temperature range: -40°C ... +250°C
silicon-containing thermally conductive paste
 
wlp.tif
  • basin: box
  • delivery quantity: 500 g
  • density: 1.1 g/cm3
  • temperature range: -40°C ... +250°C
silicon-containing thermally conductive paste
 
wlp.tif
  • basin: cartridge (310 ml)
  • delivery quantity: 300 g
  • density: 1.1 g/cm3
  • temperature range: -40°C ... +250°C
silicon-containing thermally conductive paste
 
* This information refers to the standard variant of the product, so it might change when another variant is chosen.
Accessories / similar products
Accessory Product families:
1 - 10 (155)Number:
ick_pga.tif
14 x 14 x 14 mm, for IC design PGA and others
 
ick_pga.tif
23 x 23 x 12.3 mm, for IC design PGA and others
 
ick_pga.tif
24.2 x 24.2 x 12.3 mm, for IC design PGA and others
 
ick_pga.tif
27,95 x 24,76 x 8 mm, for IC design PGA and others
 
ick_pga.tif
27,95 x 24,76 x 15,2 mm, for IC design PGA and others
 
ick_pga.tif
27.95 x 24.76 x 12.5 mm, for IC design PGA and others
 
ick_pga.tif
34,5 x 31.34 x 16,5 mm, for IC design PGA and others
 
ick_pga.tif
35 x 35 x 10 mm, for IC design PGA and others
 
ick_pga.tif
35 x 35 x 14 mm, for IC design PGA and others
 
ick_pga.tif
36 x 36 x 12.3 mm, for IC design PGA and others
 
1 - 10 (155)Number:
Product family accessory of product family:
wlfg98web.jpg
  • highly thermally conductive graphite foil
  • with and without adhesive coating
  • very good temperature resistance
  • ideally suited as a heat spreader
  • customer-specific cuts and molded parts
 
wlfgweb.jpg
  • high-compressed anisotropic natural graphite
  • very good thermal characteristics
  • optimal for heat spreading
  • high operating temperature range
  • tape width (B) available in different dimensions and lengths
  • different material thicknesses and coatings upon request
  • customer specified cuttings and stampings acc. to drawing
 
Service
Technical explanations
Data sheet

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