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2020
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02
Fair activity:
Embedded World 2020
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01
New connector catalog
f.con.e 3.1
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2019
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10
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SPS Nuremberg 2019
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09
Fastening for mounting rail
KL 35 ...
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Miniature cooling aggregates
LAM 5 D K ...
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USB connectors
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RJ 45 LED
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19" insert with low depth
VESA GT ...
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Heatsinks
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Accessories for electronic components
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Thermal interface material
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Thermal conductive paste and thermal interface film
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WLP ...
Heatsinks
f.cool
Accessories for electronic components
Thermal interface material
Thermal conductive paste and thermal interface film
Cases
f.case
Connectors
f.con
WLP ...
silicon-containing thermally conductive paste
WLP 004
silicon-containing thermally conductive paste
density:
1.1 g/cm
3
WLP 035
silicon-containing thermally conductive paste
density:
1.1 g/cm
3
WLP 500
silicon-containing thermally conductive paste
density:
1.1 g/cm
3
WLP 300 S
silicon-containing thermally conductive paste
density:
1.1 g/cm
3
WLP 500 S
silicon-containing thermally conductive paste
density:
1.1 g/cm
3
