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fsf52p_.jpg
Phase Change thermal interface material
  • strapless (free standing film) changing condition thermal conductive material as a foil
  • material with phase changing temperature at 48 °C or 52 °C
  • best thermal conductivity, above the phase change temperature the material flows in all gaps of the impinged device and heatsink
  • thixotropic, therefore no migration of the material away from the moistened surface
  • no influence on the thermal conductivity due to thermal cycles
  • only low contact pressure necessary, as it is no elastomer and therefore ideally suitable for clamp mounting of the devices
  • not electrically conductive, but no insulator
  • self-adhesive properties, also suitable for large surfaces
  • no toxic ingredients
  • customised cuts upon request
  • with double-sided protective film
  • density: 2.9 g/cm3
  • thermal resistance (1 in2, TO 3) at contact pressure of: 0.08 K/W
    0.031 N/mm2
  • temperature range: ≤+150°C
  • adhesive holding force: 0.6 N/mm2
fsf52p_.jpg
Phase Change thermal interface material
  • strapless (free standing film) changing condition thermal conductive material as a foil
  • material with phase changing temperature at 48 °C or 52 °C
  • best thermal conductivity, above the phase change temperature the material flows in all gaps of the impinged device and heatsink
  • thixotropic, therefore no migration of the material away from the moistened surface
  • no influence on the thermal conductivity due to thermal cycles
  • only low contact pressure necessary, as it is no elastomer and therefore ideally suitable for clamp mounting of the devices
  • not electrically conductive, but no insulator
  • self-adhesive properties, also suitable for large surfaces
  • no toxic ingredients
  • customised cuts upon request
  • with double-sided protective film
  • density: 2 g/cm3
  • thermal resistance (1 in2, TO 3) at contact pressure of: 0.03 K/W
    0.031 N/mm2
  • temperature range: ≤+200°C
  • adhesive holding force: 0.35 N/mm2

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