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Thermal interface material / Fixing material / Mounting material

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  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
  • thermal conductive foil based on polyester
  • particularly suitable for silicone-free applications
  • very good insulating properties
  • one-sided adhesive layer upon request
  • cuts and contours according to customer specific drawing specifications
Phase Change thermal interface material
  • strapless (free standing film) changing condition thermal conductive material as a foil
  • material with phase changing temperature at 48 °C or 52 °C
  • best thermal conductivity, above the phase change temperature the material flows in all gaps of the impinged device and heatsink
  • thixotropic, therefore no migration of the material away from the moistened surface
  • no influence on the thermal conductivity due to thermal cycles
  • only low contact pressure necessary, as it is no elastomer and therefore ideally suitable for clamp mounting of the devices
  • not electrically conductive, but no insulator
  • self-adhesive properties, also suitable for large surfaces
  • no toxic ingredients
  • customised cuts upon request
  • with double-sided protective film
  • double-side adhesive thermal conductive foil with good thermal properties
  • coated carrier film with pressure-sensitive acrylate adhesive
  • curing of the adhesive layer can be influenced by temperature and time
  • serves as a substitute for mechanical connections
  • excellent adhesive properties on aluminium and ceramics
  • simple and secure attachment of e.g. heatsinks to electronic devices
  • designs as electrically conductive or electrically insulating thermal conductive foil
  • supplied in sheet and tape form, other forms on request
  • tape width (B) available in different dimensions and lengths
  • 24h sample delivery service for individual production according to customer drawing
  • customised cuts and contours according to drawing specifications
TO 247, 23 x 20 x 1 mm, other strengths and versions on request
TO 220, 20 x 11 mm, customer specific versions on request
plate (1000 x 305 mm) suitable for blanks
  • silicone free thermal adhesive foils
  • silicone free gap-filler with good thermal characteristics
  • smooth, compressible and elastic
  • cut outs, punchings and modifications according to customer specification
  • other material thicknesses upon request
  • silicone-free thermal conductive foil
  • particularly suitable for silicone-free applications
  • very good thermal and mechanical properties
  • high electrical insulation
  • cuts and contours made of sheet or roller material according to your specifications
  • soft and adaptable acrylic-based thermal conductive foil
  • very good compensation of unevennesses and differences in components
  • natural adhesive properties and high dielectric strength
  • cuts and contours with cutouts according to customer drawings
for rail-material strengths 1-2.3 mm according to DIN EN 60 715 (formerly DIN EN 50 022)
  • one-side adhesive thermal conductive foil
  • glass fibre reinforced design
  • very good thermal conductivity
  • simple handling and mounting
  • cuts and contours according to customer’s drawing specifications
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During the contacting of two flat surfaces which have to be thermally conductive connected, i.e. transistor and heatsink, the effective contact surface is only 2-5%. The remaining surface is a air cushion. Air is the worst existing heat conductor and interferes the heat transport enormously. Heat mediating, air excluding materials are either thermal conductive pastes or other thermal conductive foils. The use of thermal conductive foil is recommended when the heat mediating materials have to result additional electric isolation beside the good heat conduction. The different types of thermal conductive foils result on the certain application. Here an easy isolation beside the thermal conductive bridging of gaps (Gap-filler) is possible. Thermal conductive foils (Thermal Interface Material) can be based on silicone elastomer or other plastics, equipped additionally with a durable or adhesive coating and is available in different thicknesses and designs. The thermal conductive foil from Fischer Elektronik is best suitable for the field of heat dissipation. Accordant to the demands of the industry various materials, designs and thicknesses will be delivered; beginning with the silicone foil in standard sizes, fitted to various device sizes for transistors, etc., as a gel, foam or polyimide foil and can be delivered also application based as a customer specified cut.