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Accessories for electronic components

1 - 12 (886)
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wsf_wsfs_16_.jpg
  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]0.30.40.450.65

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
wsf_wsfs_16_.jpg
  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]0.30.40.450.65

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
wsf_wsfs_16_.jpg
  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]0.30.40.450.65

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
wsf_wsfs_16_.jpg
  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]0.30.40.450.65

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
wsf_wsfs_16_.jpg
  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]0.30.40.450.65

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
wsf_wsfs_16_.jpg
  • elastomer foam with closed cell structure
  • good heat conductor e.g. between components, heatsinks and casing parts
  • electrical insulating
  • can be compressed even with a low contact pressure
  • absorbs shocks and vibrations

Thermal resistance at 3.2 mm material thickness:
compression [%]contact102550
contact pressure [psi]>151234
Rth [K/W] (1 in2 x 3.2 mm)64.52.51
heat conductivity [W/mK]0.30.40.450.65

  • WSFS 635 double sided adhesive and WSF self-adhesive upon request
  • according to NASA gas emission requirements
wsf_wsfs_16_.jpg
can be compressed, electrical insulating; one-sided adhesive
wfpk09.tif
  • thermal conductive foil based on polyester
  • particularly suitable for silicone-free applications
  • very good insulating properties
  • one-sided adhesive layer upon request
  • cuts and contours according to customer specific drawing specifications
gel_f_16_.jpg
  • silicone free thermal adhesive foils
  • silicone free gap-filler with good thermal characteristics
  • smooth, compressible and elastic
  • cut outs, punchings and modifications according to customer specification
  • other material thicknesses upon request
gel_f_16_.jpg
  • silicone free thermal adhesive foils
  • silicone free gap-filler with good thermal characteristics
  • smooth, compressible and elastic
  • cut outs, punchings and modifications according to customer specification
  • other material thicknesses upon request
gel_f_16_.jpg
  • silicone free thermal adhesive foils
  • silicone free gap-filler with good thermal characteristics
  • smooth, compressible and elastic
  • cut outs, punchings and modifications according to customer specification
  • other material thicknesses upon request
gel_f_16_.jpg
  • silicone free thermal adhesive foils
  • silicone free gap-filler with good thermal characteristics
  • smooth, compressible and elastic
  • cut outs, punchings and modifications according to customer specification
  • other material thicknesses upon request
1 - 12 (886)
  • 1
  • 74
Number:
* This information refers to the standard variant of the product, so it might change when another variant is chosen.
During the contacting of two flat surfaces which have to be thermally conductive connected, i.e. transistor and heatsink, the effective contact surface is only 2-5%. The remaining surface is a air cushion. Air is the worst existing heat conductor and interferes the heat transport enormously. Heat mediating, air excluding materials are either thermal conductive pastes or other thermal conductive foils. The use of thermal conductive foil is recommended when the heat mediating materials have to result additional electric isolation beside the good heat conduction. The different types of thermal conductive foils result on the certain application. Here an easy isolation beside the thermal conductive bridging of gaps (Gap-filler) is possible. Thermal conductive foils (Thermal Interface Material) can be based on silicone elastomer or other plastics, equipped additionally with a durable or adhesive coating and is available in different thicknesses and designs. The thermal conductive foil from Fischer Elektronik is best suitable for the field of heat dissipation. Accordant to the demands of the industry various materials, designs and thicknesses will be delivered; beginning with the silicone foil in standard sizes, fitted to various device sizes for transistors, etc., as a gel, foam or polyimide foil and can be delivered also application based as a customer specified cut.

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