Thermal interface material / Fixing material / Mounting material

During the contacting of two flat surfaces which have to be thermally conductive connected, i.e. transistor and heatsink, the effective contact surface is only 2-5%. The remaining surface is a air cushion. Air is the worst existing heat conductor and interferes the heat transport enormously. Heat mediating, air excluding materials are either thermal conductive pastes or other thermal conductive foils. The use of thermal conductive foil is recommended when the heat mediating materials have to result additional electric isolation beside the good heat conduction. The different types of thermal conductive foils result on the certain application. Here an easy isolation beside the thermal conductive bridging of gaps (Gap-filler) is possible. Thermal conductive foils (Thermal Interface Material) can be based on silicone elastomer or other plastics, equipped additionally with a durable or adhesive coating and is available in different thicknesses and designs. The thermal conductive foil from Fischer Elektronik is best suitable for the field of heat dissipation. Accordant to the demands of the industry various materials, designs and thicknesses will be delivered; beginning with the silicone foil in standard sizes, fitted to various device sizes for transistors, etc., as a gel, foam or polyimide foil and can be delivered also application based as a customer specified cut.