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Cooling aggregates

1 - 12 (125)Number:
la27k.tif
75,5 x 65,8 mm, with axial fan
la5.tif
112 x 116 mm, with axial fan; * for one segment
la4.tif
119 x 119 mm, with axial fan
la6.tif
62 x 74 mm, with axial fan
la7.tif
125 x 74 mm, with axial fan
la8.tif
188 x 74 mm, with axial fan
la_v6.tif
62 x 74 mm, with axial fan and air-flow chamber
la_v7.tif
125 x 74 mm, with axial fan and air-flow chamber
la_28.tif
66 x 65 mm, with axial fan
High performance cooling aggregate
  • compact construction by means of connected extruded profiles
  • excellent efficiency by means of flow-optimised hollow fin structure
  • powerful axial fans
  • double-sided precise milled semiconductor mounting surfaces
  • different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request
la_29.tif
125 x 65 mm, with axial fan
la_30.tif
190 x 65 mm, with axial fan
la_v28.tif
65 x 65 mm, with axial fan and air-flow chamber
High performance cooling aggregate
  • additional efficiency enhancement and noise reduction by means of air-technically adjusted airflow chambers
  • excellent thermal efficiency in connection with powerful axial fans
  • double-sided precise milled semiconductor mounting surfaces
  • different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request
1 - 12 (125)Number:
* This information refers to the standard variant of the product, so it might change when another variant is chosen.
The increasing construction of big load circuits for drives and controls lead to a use of always bigger and more powerful electronic devices such as IGBT and similar. In those power classes a heat dissipation is only possible by forced convection by means of cooling aggregates or fluid heatsinks. A cooling aggregate consists of an assembly of fins, lamellas or similar, suitable geometries for heat exchanging surfaces and one or more fans. The electric devices mounted on the cooling aggregate bring the developed dissipation loss as a thermal output into the construct cooling aggregate by means of heat conduction. The existing fan produces an air flow which is navigated to the internal structure in a cooling aggregate and dissipates the inserted heat to the outside. Different conceptions for a cooling aggregate are the high capacity-, segment- and miniature cooling aggregates with different structures of the heat exchanging surfaces which are equipped with axial-, diagonal or radial fans in dependence to the overall conception. The offered concepts from Fischer Elektronik are based on the cooling aggregate itself and the resulting versatile modification possibilities in size, design and type of fan.

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