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Finger shaped heatsinks

Finger shaped heatsinks for power semiconductors

fk2541sa.jpg
fk_sa_sa3.tif
fk_sa_sa3.eps

Finger shaped heatsinks

FK 318 ...
FK 254 ...

FK 254 1 SA

for semiconductor-design TO 3
Price on application
Quantity
Features
material:
aluminium, EN AW 1050 A, cold extruded part
width:
46 mm
height:
25.4 mm
length:
46 mm
thermal resistance:
5.4 K/W
surface:
black anodised
Variants
fk_sa_sa3.tif
  • height: 25.4 mm
  • thermal resistance: 5.4 K/W
  • drilling pattern: TO 3
for semiconductor-design TO 3
 
fk_sa_sa3.tif
  • height: 31.8 mm
  • thermal resistance: 4.4 K/W
  • drilling pattern: without
for semiconductor-design TO 3
 
fk_sa_sa3.tif
  • height: 31.8 mm
  • thermal resistance: 4.4 K/W
  • drilling pattern: TO 3
for semiconductor-design TO 3
 
* This information refers to the standard variant of the product, so it might change when another variant is chosen.
Technical Drawing

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