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Board Level heatsinks

1 - 12 (185)Number:
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for semiconductor-design TO 5 and others
kk1_06_35_schatten.jpg
for semiconductor-design TO 5 and others
kk1_12_07_schatten.jpg
for semiconductor-design TO 5 and others
kk1_19_05_schatten.jpg
for semiconductor-design TO 5 and others
fk_sa_sa3.tif
for semiconductor-design TO 3
fk_sa_sa3.tif
for semiconductor-design TO 3
fk_sa_sa3.tif
for semiconductor-design TO 3
fk_sa_sa3.tif
for semiconductor-design TO 3
fk_sa_sa3.tif
with perforation
fk201_sa.tif
without drilling template
fk201_sa.tif
with perforation
fk201_sa.tif
with perforation
1 - 12 (185)Number:
* This information refers to the standard variant of the product, so it might change when another variant is chosen.
Discrete electronic devices (transistors) in its corresponding housing such as TO 3, TO 5, TO 220, TO 247 and plenty more are used in many electronic circuits. The heat dissipation of those devices can succeed easily and good by means of so-called finger shaped heatsinks. The naming finger shaped heatsink is caused by its form which reminds to a hand with opened or spread fingers.

Different materials and sizes for finger shaped heatsinks
Usually finger shaped heatsinks are made of aluminium, either as a die cast part or as a formed sheet – and also, due to the device miniaturization and herewith causing heat dissipation problematic more and more made of copper. Different sizes of the finger shaped heatsinks with the resulting different heat dissipation possibilities show the best results by considering the mounting condition in the specific application. For this reason Fischer Elektronik has got a wide range of different sizes, forms and mounting possibilities and is therefore best-positioned as a qualified partner for finger shaped heatsinks. For more small devices are also available: clip-on heatsinks, miniature heatsinks as well as copper heatsinks for D PAK and more.

The range of heatsinks also comprises - beside board level heatsinks - heatsinks and fan-coolers for processors, profile- and fluid heatsinks, cooling aggregates as well as corresponding accessory.

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