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Board Level heatsinks

25 - 36 (161)Number:
fk225sa_l1.tif
for semiconductor-design TO 220
fk250_08lf_pak.tif
  • direct PCB mounting thru solderable surface
    available standard packing: loose parts (bulk goods) or reel (TR = tape and reel)
  • tape width: 24 mm, reel diameter: 330 mm, quantity: FK 250 06 = 450, FK 250 08 = 450, FK 250 10 = 350
skk58.tif
for semiconductor-design TO 5 and others
fk225sa_l2.tif
for semiconductor-design TO 220
fk250_10lf_pak.tif
  • direct PCB mounting thru solderable surface
    available standard packing: loose parts (bulk goods) or reel (TR = tape and reel)
  • tape width: 24 mm, reel diameter: 330 mm, quantity: FK 250 06 = 450, FK 250 08 = 450, FK 250 10 = 350
skk510.tif
for semiconductor-design TO 5 and others
fk228sa_l1.tif
for semiconductor-design TO 220
fk251_06lf_pak.tif
  • direct PCB mounting thru solderable surface
    available standard packing: loose parts (bulk goods) or reel (TR = tape and reel)
  • tape width: 24 mm, reel diameter: 330 mm, quantity: FK 250 06 = 450, FK 250 08 = 450, FK 250 10 = 350
  • tape width: 24 mm, reel diameter: 330 mm, quantity: FK 251 06 = 450, FK 251 08 = 350, FK 251 10 = 250
kk92.tif
for semiconductor-design TO 126. SOT 32. SOT 82
fk229sa_l1.tif
for semiconductor-design TO 220
fk251_08lf_pak.tif
  • direct PCB mounting thru solderable surface
  • available standard packing: loose parts (bulk goods) or reel (TR = tape and reel)
  • tape width: 24 mm, reel diameter: 330 mm, quantity: FK 251 06 = 450, FK 251 08 = 350, FK 251 10 = 250
kk32.tif
for semiconductor-design TO 126. SOT 32. SOT 82
25 - 36 (161)Number:
Discrete electronic devices (transistors) in its corresponding housing such as TO 3, TO 5, TO 220, TO 247 and plenty more are used in many electronic circuits. The heat dissipation of those devices can succeed easily and good by means of so-called finger shaped heatsinks. The naming finger shaped heatsink is caused by its form which reminds to a hand with opened or spread fingers.

Different materials and sizes for finger shaped heatsinks
Usually finger shaped heatsinks are made of aluminium, either as a die cast part or as a formed sheet – and also, due to the device miniaturization and herewith causing heat dissipation problematic more and more made of copper. Different sizes of the finger shaped heatsinks with the resulting different heat dissipation possibilities show the best results by considering the mounting condition in the specific application. For this reason Fischer Elektronik has got a wide range of different sizes, forms and mounting possibilities and is therefore best-positioned as a qualified partner for finger shaped heatsinks. For more small devices are also available: clip-on heatsinks, miniature heatsinks as well as copper heatsinks for D PAK and more.

The range of heatsinks also comprises - beside board level heatsinks - heatsinks and fan-coolers for processors, profile- and fluid heatsinks, cooling aggregates as well as corresponding accessory.

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