The leading manufacturer of heatsinks, thermal conductive materials, cases and connectors.
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Pin heatsinks

ICK S R 28,5 x 12,5

Ø 28,5 x 12.5 mm, pin heatsinks round
Price on application
Quantity
Features
design:
round
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
diameter:
28.5 mm
height:
12.5 mm
plate thickness:
3 mm
weight:
5.7 g
thermal resistance:
10.3 - 2.3 K/W
dissipation loss:
5.83 W
surface:
Al-natural
Technical Drawing
Accessories / similar products
Product family accessory of product family:
11 - 12 (12)Number:
wlk_sk50.tif
  • space networking thermal conductive glue made on silicone basis
  • very good thermal conductivity
  • mixing in ration 1:1 with static mixing tube
  • hardening will be proceeded at room temperature
  • wide range of temperatures
  • store cool, dark and dry
 
wlft40_023web.jpg
  • one-sided adhesive thermal conductive foil
  • additional fiberglass reinforcement
  • high long-term and mechanical stability
  • easy handling and mounting
  • cuts and contours according to customer-specific drawing specifications
 
11 - 12 (12)Number:
WLF:
wlft404_405_2.tif
non isolations, double-sided adhesive
 
wlft404_405_2.tif
isolations, double sided adhesive
 
Service
Drawing format (such as PDF, CAD)
Data sheet

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