ick_s.tif
ick_s14x14x10.eps

Pin heatsinks

ICK S 14 x 14 x 10

14 x 14 x 10 mm, pin heatsinks quadratic
Quantity
Features
design:
rectangle
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
14 mm
height:
10 mm
plate thickness:
2 mm
weight:
1.9 g
length:
14 mm
thermal resistance:
8.8 - 4.2 K/W
dissipation loss:
5.1 W
surface:
Al-natural
Technical Drawing
Accessories / similar products
Product family accessory of product family:
11 - 11Number:
wlk_sk50.tif
DELIVERY TIME ON REQUEST
  • space networking thermal conductive glue made on silicone basis
  • very good thermal conductivity
  • mixing in ration 1:1 with static mixing tube
  • hardening will be proceeded at room temperature
  • wide range of temperatures
  • store cool, dark and dry
11 - 11Number:
WLF:
wlft404_405_2.tif
non isolations, double-sided adhesive
wlft404_405_2.tif
isolations, double sided adhesive
Service
Drawing format (such as PDF, CAD)
Data sheet

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