ick_s_r_titel_quad.tif
ick_s_r160x70.eps

Pin heatsinks

ICK S R 160 x 70

Ø 160 x 70 mm, pin heatsinks round
Quantity
Features
design:
round
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
diameter:
160 mm
height:
70 mm
plate thickness:
10 mm
weight:
1055 g
thermal resistance:
1.6 - 0.15 K/W
dissipation loss:
37.5 W
surface:
black anodised
Technical Drawing
Service
Drawing format (such as PDF, CAD)
Data sheet

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