The leading manufacturer of heatsinks, thermal conductive materials, cases and connectors.
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Pin heatsinks

ICK S R 100 x 70

Ø 100 x 70 mm, pin heatsinks round
Price on application
Quantity
Features
design:
round
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
diameter:
100 mm
height:
70 mm
plate thickness:
10 mm
weight:
381.5 g
thermal resistance:
2 - 0.25 K/W
dissipation loss:
30 W
surface:
black anodised
Technical Drawing
Service
Drawing format (such as PDF, CAD)
Data sheet

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