ick_s.tif
ick_s10x10x6.5.eps

Pin heatsinks

ICK S 10 x 10 x 6,5

10 x 10 x 6,5 mm, pin heatsinks quadratic
Quantity
Features
design:
rectangle
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
10 mm
height:
6.5 mm
plate thickness:
2 mm
weight:
1 g
length:
10 mm
thermal resistance:
25 - 18 K/W
dissipation loss:
2.5 W
surface:
Al-natural
Technical Drawing
Accessories / similar products
Product family accessory of product family:
1 - 10 (11)Number:
wlft404_405_.jpg
suitable for blanks
wlp.tif
silicon-containing thermally conductive paste
wlpf.tif
silicone-free thermal transfer compound
wlpk.tif
Ceramic filled, silicone-free thermal conductive paste with high thermal conductivity
wlk5_10web.jpg
thermally conductive, electrically not conductive
wlk30_120web.jpg
thermally conductive, electrically not conductive
wlk_dk.tif
  • solvent-free and thermal conductive two part adhesive
  • epoxy based filled with aluminium oxide
  • composition of hardener and resin (1:1) with statical mixing tube
  • lockability of the container via Luer-Lock System
  • good usage and working properties
  • more package sizes and container types upon request
  • store cool and dry
wlft88_16_.jpg
wlft30_.jpg
  • one-side adhesive thermal conductive foil
  • glass fibre reinforced design
  • very good thermal conductivity
  • simple handling and mounting
  • cuts and contours according to customer’s drawing specifications
wlft8926_webfoto.tif
  • double-sided adhesive thermal conductive foil
  • excellent adhesive properties on different materials
  • filling material with ceramic particles
  • very good thermal conductivity and technical performance
  • cuts and contours according to customer’s drawing specifications
1 - 10 (11)Number:
WLF:
wlft404_405_2.tif
isolations, double sided adhesive
wlft404_405_2.tif
non isolations, double-sided adhesive
Service
Drawing format (such as PDF, CAD)
Data sheet

Cookies