ick_led_r29x11.5gweb.jpg
ick_led_r29x11.5g.eps

Heatsinks for LEDs

ICK LED R 29 x 11,5 G

Ø 29 x 11.5 mm, for IC design LED
Quantity
Features
diameter:
29 mm
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
height:
11.5 mm
plate thickness:
3.5 mm
thermal resistance:
17.8 - 4 K/W
dissipation loss:
8 W
surface:
black anodised
Technical Drawing
Accessories / similar products
Product family accessory of product family:
11 - 11Number:
wlk_sk50.tif
  • space networking thermal conductive glue made on silicone basis
  • very good thermal conductivity
  • mixing in ration 1:1 with static mixing tube
  • hardening will be proceeded at room temperature
  • wide range of temperatures
  • store cool, dark and dry
11 - 11Number:
WLF:
wlft404_405_2.tif
non isolations, double-sided adhesive
wlft404_405_2.tif
isolations, double sided adhesive
Service
Drawing format (such as PDF, CAD)
Data sheet

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