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Heatsinks for BGAs

1 - 12 (39)Number:
ickbga10x10.jpg
10 x 10 x 6 mm, for IC design BGA and others
  • particularly suited for Ball Grid Arrays
  • heatsink dimensions match the respective BGA-type
  • can be glued directly on the BGA component
  • double-sided adhesive thermal conductive foil WLF ...
  • surface: black anodised
ickbga10x10x10.jpg
10 x 10 x 10 mm, for IC design BGA and others
ickbga11x11x6.jpg
11 x 11 x 6 mm, for IC design BGA and others
ickbga11x11x10.jpg
11 x 11 x 10 mm, for IC design BGA and others
ickbga14x14.jpg
14 x 14 x 6 mm, for IC design BGA and others
ickbga14x14x10.jpg
14 x 14 x 10 mm, for IC design BGA and others
ickbga15x15x6.jpg
15 x 15 x 6 mm, for IC design BGA and others
ickbga15x15x10.jpg
15 x 15 x 10 mm, for IC design BGA and others
ickbga15x15x14.jpg
15 x 15 x 14 mm, for IC design BGA and others
ickbga19x19x6.jpg
19 x 19 x 6 mm, for IC design BGA and others
ickbga19x19x10.jpg
19 x 19 x 10 mm, for IC design BGA and others
ickbga19x19x14.jpg
19 x 19 x 14 mm, for IC design BGA and others
1 - 12 (39)Number:
* This information refers to the standard variant of the product, so it might change when another variant is chosen.

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