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Heatsinks for BGAs

Heatsinks for BGAs

ICK BGA 19 x 19 x 10

19 x 19 x 10 mm, for IC design BGA and others
Price on application
Quantity
Features
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
19 mm
height:
10 mm
plate thickness:
1.8 mm
length:
19 mm
thermal resistance:
26 - 10 K/W
dissipation loss:
2.3 W
surface:
black anodised
Technical Drawing
Accessories / similar products
WLF:
wlft404_405_2.tif
isolations, double sided adhesive
 
wlft404_405_2.tif
non isolations, double-sided adhesive
 
Service
Drawing format (such as PDF, CAD)
Data sheet

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