The leading manufacturer of heatsinks, thermal conductive materials, cases and connectors.
Service hotline
MON-THR 7:30 - 15:45
FRI 7:30 - 15:15
E-mail service
flku10.jpg
flku10_uebersicht.eps
flku10.eps

Fluid coolers

FLKU 10 ...

  • technical data refer to a water inlet temperature of 23 °C
  • stainless austenitic steel / 1.4404 stainless steel V4A
  • water as a cooling medium without corrosion protection inhibitors
  • suitable liquid pumps and hose systems on request
  • other materials with higher thermal conductivity (nickel) on request
  • version with soldering for PCB mounting on request
  • customer-specific adaptations and designs

 * ground flat

Liquid coolers for circuit board assembly; produced in 3D printing with an AI-optimized heat exchange structure; dissipation of large amounts of heat with little space requirement; particularly suitable for power semiconductors in TO case, SIP Multiwatt and similar; simple and safe component assembly using lock-in retaining springs for transistors from the THFU series; separate cooling circuit on each mounting side; minimized flow pressure losses through optimized heat exchange structure; finely ground semiconductor mounting surfaces with very good flatness and low surface roughness; maximum operating pressure up to 3 bar; max. dissipated power loss with a difference in water temperature (IN = 33 ° C, OUT = 43 ° C) of 670W; simple connection via plastic hoses from the pneumatics area; dimensional adjustments to the given installation conditions

Price on application
Quantity
Features
width:
9.6 mm
height:
30 mm
length:
45 mm
material:
stainless steel 1.4404
Variants
flku10.jpg
  • mounting method: with solder pin
 
flku10.jpg
FLKU 10 ...
 
Technical Drawing
Service
Technical explanations
Data sheet

Cookies