Data sheet Product ICK S R 70 x 50

ick_s_r_titel_quad.tif
Heatsinks and active heatsinks for processors>Pin heatsinks
Ø 70 x 50 mm, pin heatsinks round

Features

design:
round
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
diameter:
70 mm
height:
50 mm
plate thickness:
5 mm
weight:
135.56 g
thermal resistance:
3.5 - 0.75 K/W
dissipation loss:
17.14 W
surface:
Al-natural

Technical Drawing