Data sheet Product ICK S R 98 x 30

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Heatsinks and active heatsinks for processors>Pin heatsinks
Ø 98 x 30 mm, pin heatsinks round

Features

design:
round
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
diameter:
98 mm
height:
30 mm
plate thickness:
5 mm
weight:
117.5 g
thermal resistance:
3.7 - 0.5 K/W
dissipation loss:
16.22 W
surface:
Al-natural

Technical Drawing