Data sheet Product ICK S R 36,5 x 20

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Heatsinks and active heatsinks for processors>Pin heatsinks
Ø 36,5 x 20 mm, pin heatsinks round

Features

design:
round
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
diameter:
36.5 mm
height:
20 mm
plate thickness:
3.5 mm
weight:
17.59 g
thermal resistance:
7.2 - 1.5 K/W
dissipation loss:
8.33 W
surface:
Al-natural

Technical Drawing