Data sheet Product ICK S R 32,5 x 10

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Heatsinks and active heatsinks for processors>Pin heatsinks
Ø 32.5 x 10 mm, pin heatsinks round

Features

design:
round
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
diameter:
32.5 mm
height:
10 mm
plate thickness:
3 mm
weight:
9.7 g
thermal resistance:
11.9 - 2 K/W
dissipation loss:
5.04 W
surface:
Al-natural

Technical Drawing