Data sheet Product ICK PGA 14 x 14 x 14

ick_pga.tif
Heatsinks and active heatsinks for processors>Heatsinks for PGA
35 x 35 x 14 mm, for IC design PGA and others

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
35 mm
height:
14 mm
plate thickness:
2.5 mm
length:
35 mm
thermal resistance:
9.6 - 2 K/W
dissipation loss:
12.5 W
surface:
black anodised

Technical Drawing

ick_pga14x14x14.eps