Data sheet Product ICK PGA 14 x 14

ick_pga.tif
Heatsinks and active heatsinks for processors>Heatsinks for PGA
34,5 x 31.34 x 16,5 mm, for IC design PGA and others

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
34.5 mm
height:
16.51 mm
plate thickness:
5 mm
length:
31.34 mm
thermal resistance:
10 - 2.3 K/W
dissipation loss:
4.9 W
surface:
black anodised

Technical Drawing