Data sheet Product ICK PGA 11 x 11 x 8

ick_pga.tif
Heatsinks and active heatsinks for processors>Heatsinks for PGA
27,95 x 24,76 x 8 mm, for IC design PGA and others

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
27.95 mm
height:
8 mm
plate thickness:
2.5 mm
length:
24.76 mm
thermal resistance:
16 - 7.8 K/W
dissipation loss:
7.5 W
surface:
black anodised

Technical Drawing