Data sheet Product ICK PGA 11 x 11

ick_pga.tif
Heatsinks and active heatsinks for processors>Heatsinks for PGA
27,95 x 24,76 x 15,2 mm, for IC design PGA and others

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
27.95 mm
height:
15.24 mm
plate thickness:
3.5 mm
length:
24.76 mm
thermal resistance:
10.9 - 2.6 K/W
dissipation loss:
4.5 W
surface:
black anodised

Technical Drawing