Data sheet Product ICK LED R 33 x 10 G

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Heatsinks and active heatsinks for processors>Heatsinks for LEDs
Ø 33 x 10 mm, for IC design LED

Features

diameter:
33 mm
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
height:
10 mm
plate thickness:
3 mm
thermal resistance:
18.15 - 3.8 K/W
dissipation loss:
6.6 W
surface:
black anodised

Technical Drawing