Data sheet Product ICK BGA 19 x 19 x 6

ickbga19x19x6.jpg
Heatsinks and active heatsinks for processors>Heatsinks for BGAs
19 x 19 x 6 mm, for IC design BGA and others

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
19 mm
height:
6 mm
plate thickness:
1.8 mm
length:
19 mm
thermal resistance:
27 - 11 K/W
dissipation loss:
2 W
surface:
black anodised

Technical Drawing