Data sheet Product ICK BGA 15 x 15 x 14

ickbga15x15x14.jpg
Heatsinks and active heatsinks for processors>Heatsinks for BGAs
15 x 15 x 14 mm, for IC design BGA and others

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
15 mm
height:
14 mm
plate thickness:
1.8 mm
length:
15 mm
thermal resistance:
25.5 - 6.1 K/W
dissipation loss:
2.3 W
surface:
black anodised

Technical Drawing