Data sheet Product ICK BGA 11 x 11 x 6

ickbga11x11x6.jpg
Heatsinks and active heatsinks for processors>Heatsinks for BGAs
11 x 11 x 6 mm, for IC design BGA and others

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
11 mm
height:
6 mm
plate thickness:
1.8 mm
length:
11 mm
thermal resistance:
31 - 9 K/W
dissipation loss:
1.9 W
surface:
black anodised

Technical Drawing