Data sheet Product ICK BGA 10 x 10

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Heatsinks and active heatsinks for processors>Heatsinks for BGAs
10 x 10 x 6 mm, for IC design BGA and others
  • particularly suited for Ball Grid Arrays
  • heatsink dimensions match the respective BGA-type
  • can be glued directly on the BGA component
  • double-sided adhesive thermal conductive foil WLF ...
  • surface: black anodised

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
10 mm
height:
6 mm
plate thickness:
1.8 mm
length:
10 mm
thermal resistance:
32 - 10 K/W
dissipation loss:
1.8 W
surface:
black anodised

Technical Drawing