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SMT heatsinks for LFPAK

In addition to heatsinks for surface-mounted electronic components with casings D PAK (TO 252), D2PAK (TO263) and D3PAK (TO268), Fischer Elektronik have developed special SMT heatsinks to suit casings for the LFPAK product line. Based on an initial Power MOSFET design for DC/DC converters, these LFPAK (loss-free package) casings have a smaller overall size and a better performance. Heatsinks by Fischer Elektronik are adapted to these sizes and they are especially suitable for SOT 669 and SO IC-8 FL MP designs, a great number of Power SO types, SO-8 and many others. LFPAK heatsinks are made from copper and provided with a solderable surface finish. They will be directly soldered to the heat conductive Cu surface of the PCB. The conductive surface may be quite freely designed, as no drill holes are required in the PCB. As it operates on the principle of indirect heat radiation, the heatsink has no direct contact with the component. Therefore it can be easily integrated into the pick-and-place and soldering processes as, with their tape and reel packaging, they can be used in the same way as any other SMT component. The product specialists at Fischer Elektronik are at your disposal to answer your questions and to give you any other information you may require.

 

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Fischer Elektronik GmbH und Co. KG

Nottebohmstraße 28

58511 Lüdenscheid

GERMANY / DEUTSCHLAND

 

Phone: +49 2351 435-0

Fax: +49 2351 457-54

info@‍fischerelektronik.de

www.fischerelektronik.de


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