SMT Heatsinks for D-PAK
In the field of surface-mounted electronic components (SMD), the use of cases of the D PAK, ( D PAK (TO 252), D2PAK (TO263) and D3PAK (TO268) ) series is increasingly common. Fischer Elektronik manufactures heatsinks to suit these case types, which provide effective heat dissipation. The special geometry of the copper heatsink with excellent heat conductivity, in combination with a solderable surface enables it to be directly soldered onto the PCB. The heatsink is soldered onto a copper heat spreader surface on the PCB, and the heat is then dissipated by the heatsink to the ambient. Since no holes are required in the PCB, the heat spreader surface may be freely designed to meet individual needs. This indirect heat dissipation, and the heatsink component not being in direct contact, offers the benefit of simplifying the placement and soldering process. The heatsinks which are carried on a reel for automatic feeding may be handled like any other SMT component.