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Extruded heatsinks for PCB mounting

The increasing density of functions and ports in electronic power semiconductors and their steadily increasing packing density on the PCB generate a certain amount of lost heat when they are operated, which needs to be carried away by suitable heat dissipation concepts. One effective method for dissipating the heat generated by electronic PCB components in a targeted manner has always been the attachment of the semiconductor in question to the heatsink. Specifically for this use case, Fischer Elektronik GmbH & Co. KG is now expanding its comprehensive product range by additional extruded heatsinks for PCB mounting. The innovative heatsink models SK 609, SK 610 and SK 611 are particularly tailored for use with power transistors TO 218, TO 247, TO 248, TO 264 and SOT 429 in their dimensions and in thermotechnical terms. Extruded threads that are directly integrated in the profile permit the component to be mounted by means of an M3 screw connection, as is also the case for fastening the heatsink to the PCB. Also available for attaching the heatsink to the PCB are screw-in solder pins that will ensure direct soldering to the board when they are screwed into the threads. The special design of the extruded profiles furthermore provides a superstructure across electronic components of various heights. Additional mechanical treatments, custom designs and surface finishes can also be provided for your specific application.

The product specialists at Fischer Elektronik www.fischerelektronik.de will be happy to assist you with any queries you may have or any additional information you require.

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