​ » Heatsink cooling aggregate for PCBs​

Heatsink cooling aggregate for PCBs

Where free convection is insufficient or the geometric dimensions or weight of a high-performance heatsink appear unsuitable for the respective application, the heat from major power losses can often only be dissipated by forced cooling with fan motors. Fischer Elektronik is now specifically expanding its comprehensive product range by a further heatsink cooling aggregate for this application case. The new product with article number LA 27 K … can also be directly installed on the PCB. Special solderable screw-in pins, insertable in a unique geometry, are available for this. The outer walls of the base section feature integrated grooves for fastening various types of transistor case using universal lock-in retaining springs. The cover plates inserted in the section at the top and bottom form a closed ventilation duct for optimal flow conditions. The aluminium base section is furthermore available without axial fan motor and plates as article number SK 617. Other mechanical finishes and surface coatings as well as other fan types and voltages can be realized in keeping with customer specifications.

The product specialists at Fischer Elektronik info@‍fischerelektronik.de will be happy to assist you with any queries you may have or any additional information you require.

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