Circuit board connectors with smaller grids
The design of electronic modules is becoming more and more compact. For the manufacturers of connectors, this creates a need for sizes with smaller grid spacing. Which is also the reason why 2.0 mm and 1.27 mm grids are steadily gaining in importance besides the standard grid spacing of 2.54 mm. The requirements are meanwhile usually the same. The temperature resistance of the plastic bodies needs to be suitable for reflow soldering processes. The plastic used for these insulators need to safely fill the ever smaller wall thicknesses of a few tenths of a millimetre. The potential current carrying capacity should not be significantly lower, at least where the 2.0 mm grid spacing is concerned. This is where the so-called LCPs - or liquid crystal polymers - are increasingly gaining in importance. The contact materials should have a certain resistance to bending, especially where contact pins are concerned. Besides the CuZn alloys, which have a good electrical conductivity, CuSn alloys are especially suitable for bending-critical headers. The suitable packaging for automatic machines is also increasingly becoming a basis for the commercial success. What is increasingly emerging in this respect is the use of so-called tape and reel packages. The product specialists at Fischer Elektronik firstname.lastname@example.org will be happy to assist you with any queries you may have or any additional information you require.